With speeds of up to 20 gigabits per second and the ability to support up to one million devices per square kilometer, 5G — the current generation of mobile communications technology — may seem impressive, but 6G is set to take these capabilities even further. Envisioned to deliver a peak data rate of 1 terabit per second and latency of 100 microseconds or less, 6G must be able to seamlessly and securely deliver data in an ever increasingly saturated network of wireless connections without exceeding the energy requirements of 5G.

This book covers every aspect of future communications, from key technologies, to design challenges, network requirements, and users experiences; to standardization, chip design, and industry applications from 5G to 6G. It presents the requirements and use cases of 6G, RF transceivers roadmap for 2030 and beyond, and modeling of RF devices for 5G/6G applications. In here, a modified Shannon's capacity formula that is critical for future advanced wireless communications such as 6G is discussed for the first time. It also presents the standardization of 6G wireless communication systems with emphasis on Standard Development Organizations (SDOs), regulatory bodies and administrations, ITU, industry forums, and 6G standard timeline. The book presents an RF/mm-wave integrated circuit design for future communications to provides readers with an easy-to-understand overview of voltage-controlled oscillators, power amplifiers, low-noise amplifiers, frequency synthesizers, high-frequency dividers, and chip-to-chip communications isolation technology.

This book is an excellent reference for readers specializing in electrical and electronic engineering, wireless communication, integrated circuit design, circuits and systems, to learn more about 5G and even 6G communication standards and RF/mm-wave IC design. In particular, professionals working in the foundry, fabless semiconductor companies, original equipment manufacturers, and integrated device manufacturers will also benefit from this book.

Contents:
CONVERGENCE:Transceivers for Future Communications (Bharatha Kumar, Mahalingam Nagarajan, Dipu Bhaskar and Kiat Seng Yeo)COMMUNICATION:Modified Shannon Capacity for Wireless Communications (Jianguo Ma)CONNECTIVITY:Random Access: Connection-Free or Connection-Based? (Yayu Gao, Wen Zhan and Lin Dai)COMPONENT:Microwave and Millimeter-Wave Phase Change Material Devices for Future Communications (Tejinder Singh and Raafat R Mansour)CONFORMITY:Standardization of 6G Wireless Communication Systems (Sumei Sun, Yonghong Zeng and Amnart Boonkajay)CIRCUIT:Generalized Multiple Tanks Based RF/mm-wave IC for Future Communications (Kaixue Ma, Zhen Yang, Chenyang Meng, Xinbo Zhang and Kiat Seng Yeo)CHIP:Chip-to-Chip Communications Over a Galvanic Isolation Barrier (Richard Lum)
Readership: Advanced undergraduate- and graduate-level students as well as faculty and researchers in electrical & electronic engineering, wireless communication, integrated circuit design and circuits & systems. This book can be used as an excellent reference for communication engineers working on 5G, 5G and beyond and even 6G, communication standards, RF/mm-wave IC designers, engineers, consultants, engineering managers and directors, instructors and scientists working in the foundry, fabless semiconductor company, original equipment manufacturer and integrated device manufacturer.